| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MT53E1G32D2FW-046 WT:B | MICRON/美光 | 25+ | 10000 | 2026-04-20 | ||||
| K4F2E3S4HM-MGCJ | SAMSUNG/三星 | 25+ | 11200 | 2026-04-20 | ||||
| H9JKNNNFB3AECR-N6H | SKHYNIX/海力士 | BGA | 24+ | 50000 | 2025-12-09 | |||
| HN8T15BZGKX016N | SKHYNIX/海力士 | BGA | 24+ | 10000 | 2025-12-09 | |||
| KM8F9001JM-B813T07 8+256 | SAMSUNG/三星 | BGA | 22+ | 60000 | 2025-12-09 | |||
| K4F6E3S4HM-GHCL | SAMSUNG/三星 | BGA | 24+ | 30000 | 2025-12-09 | |||
| KMDV6001DA-B620 | SAMSUNG/三星 | BGA | 20000 | 2025-12-09 | ||||
| HN8T15BZGKX016N 256G | SKHYNIX/海力士 | BGA | 24+ | 15000 | 2025-12-09 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MT53E1G32D2FW-046 WT:B | MICRON/美光 | 25+ | 10000 | 2026-04-20 | ||||
| NT5AD512M8E3-JRI | NANYA/南亚 | BGA | 24+ | 50000 | 2025-12-09 | |||
| K4U6E3S4AA-MGCR | SAMSUNG/三星 | BGA | 24+ | 2000 | 2025-12-09 | |||
| K4F6E3S4HB-MGCL | SAMSUNG/三星 | BGA | 24+ | 2000 | 2025-12-09 | |||
| H58GG6MK6GX037-REV | SKHYNIX/海力士 | BGA | 24+ | 50000 | 2025-12-09 | |||
| H9JKNNNFB3AECR-N6H | SKHYNIX/海力士 | BGA | 24+ | 50000 | 2025-12-09 | |||
| KM8F9001JM-B813T07 8+256 | SAMSUNG/三星 | BGA | 22+ | 60000 | 2025-12-09 | |||
| K4F6E3S4HM-GHCL | SAMSUNG/三星 | BGA | 24+ | 30000 | 2025-12-09 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| XSYMM008G18-C66A | 芯生源半导体 | BGA | 25+ | 300000 | 2026-07-06 | |||
| MT53E1G32D2FW-046WT:B | MICRON/美光 | 0 | 10000 | 2026-07-06 | ||||
| HS58GG6M6GX037 | SKHYNIX/海力士 | BGA | 24+ | 40000 | 2026-07-06 | |||
| SM2G64Y52PD8FZA-UT | MICRON/美光 | BGA | 24+ | 20000 | 2026-07-06 | |||
| SM2G64Y42MD8FCL-UT | MICRON/美光 | BGA | 24+ | 20000 | 2026-07-06 | |||
| K4A8E3S4HD-MGCLOJP | SAMSUNG/三星 | BGA | 24+ | 30000 | 2026-07-06 | |||
| K4A8G165WB-BCRC | SAMSUNG/三星 | BGA | 25+ | 500000 | 2026-04-13 | |||
| K4A8G085WG-BCWE | SAMSUNG/三星 | BGA | 24+ | 20000 | 2025-12-09 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| XSYMM008G18-C66A | 芯生源半导体 | BGA | 25+ | 300000 | 2026-07-06 | |||
| K4A8E3S4HD-MGCLOJP | SAMSUNG/三星 | BGA | 24+ | 30000 | 2026-07-06 | |||
| HS58GG6M6GX037 | SKHYNIX/海力士 | BGA | 24+ | 40000 | 2026-07-06 | |||
| SM2G64Y52PD8FZA-UT | MICRON/美光 | BGA | 24+ | 20000 | 2026-07-06 | |||
| SM2G64Y42MD8FCL-UT | MICRON/美光 | BGA | 24+ | 20000 | 2026-07-06 | |||
| K4A8G165WB-BCRC | SAMSUNG/三星 | BGA | 25+ | 500000 | 2026-04-13 | |||
| H5AN8G8NJR-XNC | SKHYNIX/海力士 | BGA | 24+ | 20000 | 2025-12-09 | |||
| K4A8G085WG-BCWE | SAMSUNG/三星 | BGA | 24+ | 20000 | 2025-12-09 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| TPSM82823ASILR | TI/德州仪器 | BGA | 60000 | 2025-12-09 |